LTCC and Hybrid Modules
Advanced Multichip LTCC Modules Production Line with Packaging and Test Facility
Due to higher operating frequencies and miniature size (hence, higher thermal load of hot spots) of modern electronics LTCC is gaining more and more attention. The old technique becomes more popular due to its unique RF and thermal performance, recent qualification of LTCC materials for use in space-grade electronics and base material cost going down.
Since 2008 our team has installed several turn key facilities for LTCC production, as well as many individual units, such as via fillers or precision quartz chamber ovens. We operate on a long-term agreements with top equipment manufacturers from the USA and Europe and provide for hands on training of customers’ operators and technicians.
LTCC project can include various scope of supply, from base material preparation and slurry casting, to development software, and test and measurement kit that includes RF simulation and structural analysis. The exact scope of supply is always discussed with a customer as part of project planning.
Operators and technicians’ training programs are available as 2 weeks courses in a top facility in West Europe, and comes with full theory of LTCC and a hands-on practical training, as well as discussion on materials used. Our customers now manufacture LTCC structures for use in RF and high reliability products, as well as discretes and high density interconnects for ASICs.
We are flexible to provide just partial services, such as just LTCC assembly kit or a zero-shrinkage firing solution. Our experience in test and measurement includes ultrasonic scanning, photoemission microscopy, laser profiling, thermal behaviour and other techniques of quality assessment and R&D.
Fine Line photoimageable process can be used for both fired ceramics and LTCC, thus making our customers' design rules broader. Pastes' chemistry allows for virtually any type of metal to form a fine line conductor (main compositions are silvers, silver-palladium, gold and platinum). A fine line dielectric paste completes the range, allowing for miniature vias and gaps features. Combinations of different fine line pastes (e.g., silver-palladium main tracks with gold end pads for wire bonding) were reported as successful.
Hybrids | Packaging | MicroElectronics | Testing