qualified installation and service engineers

Recent Projects Worldwide

Example Works from over 25 years experience.

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Chip Resistors

Turn Key manufacturing lines for high precision, high mix low-volume chip resistor production

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Power IGBT Modules Production

Turn Key mid-volume production and test facility

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Advanced Wire Bonding Applications

Ball, Wedge, TAB and Ribbon bonding for ASICs, discretes, RF and power electronics

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LED modules

SMT and Packaging Lines for a “Connected City” LED Streetlights network

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Versatile hermetic packages sealing

Complex production line with high vacuum outgassing, Parallel Seam and Laser welding stations and gas recirculation modules.

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Fine Line Thick Film Hybrids

Turn Key solutions and process consulting for Thick Film fine line hybrids, including multilayers on fired and LTCC ceramics for high density interconnects and RF applications

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LTCC and Hybrid Modules

Advanced Multichip LTCC Modules Production Line with Packaging and Test Facility

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Hybrids | Packaging | MicroElectronics | Testing

Our Expertise​

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